FLIR Boson+ 640 Thermal Core Module
The Boson+ 640 is positioned as a best-in-class, compact OEM thermal core thanks to its small form factor, low power consumption and modern software SDK that simplify custom-interface work for third‑party optics integration. Compared with legacy 640 cores on this list it delivers a lower total-cost-of-integration and faster time-to-market for volume OEMs, while offering competitive image quality and factory calibration that reduce the amount of per‑lens tuning required. Its price-performance balance and broad accessory ecosystem make it the easiest drop‑in choice when footprint and development velocity matter most.
Compact powerhouse
Low-power appetite
Compact powerhouse
Low-power appetite
Review Summary
"Users praise the Boson+ 640 for its excellent image quality, low power draw and compact OEM-friendly design with reliable long-term performance; some note occasional calibration quirks, firmware/SDK compatibility issues, and supply constraints."
Crisp thermal detail
640×512 LWIR sensor offering high sensitivity for detailed thermal imaging
Crisp thermal detail
640×512 LWIR sensor offering high sensitivity for detailed thermal imaging
Skill Development & Mastery
Time-Saving Convenience
The Boson+ 640 is positioned as a best-in-class, compact OEM thermal core thanks to its small form factor, low power consumption and modern software SDK that simplify custom-interface work for third‑party optics integration. Compared with legacy 640 cores on this list it delivers a lower total-cost-of-integration and faster time-to-market for volume OEMs, while offering competitive image quality and factory calibration that reduce the amount of per‑lens tuning required. Its price-performance balance and broad accessory ecosystem make it the easiest drop‑in choice when footprint and development velocity matter most.
Compact powerhouse
Low-power appetite
Crisp thermal detail
640×512 LWIR sensor offering high sensitivity for detailed thermal imaging
Compact SWaP design with standard mechanical footprints and lens-mount options for third‑party optics coupling
Compact powerhouse
Low-power appetite
Crisp thermal detail
640×512 LWIR sensor offering high sensitivity for detailed thermal imaging
Compact SWaP design with standard mechanical footprints and lens-mount options for third‑party optics coupling
$3,000-6,000 CAD
Teledyne FLIR Tau 2 640 OEM Core
The Tau 2 640 is a market-proven leader for applications that require ruggedness, long service life and field-proven interoperability with third‑party optics and mounting standards. Although typically positioned at a higher unit price than the Boson+ and Mosaic cores, Tau 2’s mature mechanical form factor, long-term availability and extensive legacy integration documentation lower lifecycle risk and total cost for defense and industrial OEMs. For integrators who value proven thermal stability and broad systems support over minimal footprint, Tau 2 remains the conservative choice.
Rugged reliability
Long-range clarity
Rugged reliability
Long-range clarity
Review Summary
"The Teledyne FLIR Tau 2 640 is regarded as a rugged, proven core with consistent image quality and solid integration options, though many users call it older/bulkier technology compared with newer Boson modules and report diminishing availability/support."
Legacy charm
Proven 640×512 microbolometer core widely used in OEM thermal products
Legacy charm
Proven 640×512 microbolometer core widely used in OEM thermal products
Skill Development & Mastery
Time-Saving Convenience
The Tau 2 640 is a market-proven leader for applications that require ruggedness, long service life and field-proven interoperability with third‑party optics and mounting standards. Although typically positioned at a higher unit price than the Boson+ and Mosaic cores, Tau 2’s mature mechanical form factor, long-term availability and extensive legacy integration documentation lower lifecycle risk and total cost for defense and industrial OEMs. For integrators who value proven thermal stability and broad systems support over minimal footprint, Tau 2 remains the conservative choice.
Rugged reliability
Long-range clarity
Legacy charm
Proven 640×512 microbolometer core widely used in OEM thermal products
Modular electronics with common analog/digital interfaces and multiple lens options for third‑party optics
Rugged reliability
Long-range clarity
Legacy charm
Proven 640×512 microbolometer core widely used in OEM thermal products
Modular electronics with common analog/digital interfaces and multiple lens options for third‑party optics
$2,500-5,500 CAD
Seek Thermal Mosaic Core S309
The Mosaic Core S309 targets high-volume OEMs by delivering a very competitive price-per-pixel and a compact, highly integrated sensor package that simplifies mechanical and electrical interfacing to third‑party optics. Compared to the FLIR cores in this list, the Mosaic S309 often offers a lower acquisition cost and smaller BOM impact, making it attractive for cost-sensitive consumer and industrial products, though it trades off the longer field history and extensive support ecosystem of the Tau 2. Its tight integration and pricing make it an excellent option when minimal external components and per-unit cost are primary drivers.
High-frame agility
Dense resolution
High-frame agility
Dense resolution
Review Summary
"The Seek Thermal Mosaic Core S309 is viewed as a cost-effective, higher-resolution OEM option that delivers good value, but buyers commonly report lower sensitivity than premium cores, variable quality control, and limited documentation/software."
Pocket rocket
Compact, low-cost microbolometer core designed for embedded OEM applications
Pocket rocket
Compact, low-cost microbolometer core designed for embedded OEM applications
Recreational Enjoyment
Skill Development & Mastery
The Mosaic Core S309 targets high-volume OEMs by delivering a very competitive price-per-pixel and a compact, highly integrated sensor package that simplifies mechanical and electrical interfacing to third‑party optics. Compared to the FLIR cores in this list, the Mosaic S309 often offers a lower acquisition cost and smaller BOM impact, making it attractive for cost-sensitive consumer and industrial products, though it trades off the longer field history and extensive support ecosystem of the Tau 2. Its tight integration and pricing make it an excellent option when minimal external components and per-unit cost are primary drivers.
High-frame agility
Dense resolution
Pocket rocket
Compact, low-cost microbolometer core designed for embedded OEM applications
Optimized for low power and straightforward mechanical integration with third‑party lenses
High-frame agility
Dense resolution
Pocket rocket
Compact, low-cost microbolometer core designed for embedded OEM applications
Optimized for low power and straightforward mechanical integration with third‑party lenses
$800-1,800 CAD
LWIR Micro III 640 Thermal Module
The Micro III 640 is aimed at integrators that need high thermal sensitivity and a modular optical interface specifically designed for custom third‑party lenses and cryo‑free assemblies. Technically it sits between the compact Boson+ and the rugged Tau 2: offering superior NETD and optical customization options to the Boson+ while keeping a more modern, lighter form factor than many legacy cores, and typically at a mid-tier price point. For projects where per‑lens calibration and specialized optics mounts are required, the Micro III reduces integration overhead by providing configurable interfaces and factory tuning services.
Ultra sensitivity
Stable imaging
Ultra sensitivity
Stable imaging
Review Summary
"The LWIR Micro III 640 offers competitive LWIR imaging at a lower price with flexible optics interfaces, but long-term users cite thermal drift, occasional QA inconsistencies, and less mature SDK/support compared with market leaders."
Modular interface
640×512 LWIR detector offering high sensitivity, low NETD, and selectable frame-rate options
Modular interface
640×512 LWIR detector offering high sensitivity, low NETD, and selectable frame-rate options
Skill Development & Mastery
Time-Saving Convenience
The Micro III 640 is aimed at integrators that need high thermal sensitivity and a modular optical interface specifically designed for custom third‑party lenses and cryo‑free assemblies. Technically it sits between the compact Boson+ and the rugged Tau 2: offering superior NETD and optical customization options to the Boson+ while keeping a more modern, lighter form factor than many legacy cores, and typically at a mid-tier price point. For projects where per‑lens calibration and specialized optics mounts are required, the Micro III reduces integration overhead by providing configurable interfaces and factory tuning services.
Ultra sensitivity
Stable imaging
Modular interface
640×512 LWIR detector offering high sensitivity, low NETD, and selectable frame-rate options
Robust mechanical design with precision optics mounting to integrate with specialized third‑party lenses
Ultra sensitivity
Stable imaging
Modular interface
640×512 LWIR detector offering high sensitivity, low NETD, and selectable frame-rate options
Robust mechanical design with precision optics mounting to integrate with specialized third‑party lenses
$4,000-8,000 CAD
Opgal Therm-App TH Series OEM Module
Opgal’s Therm-App TH Series OEM modules are distinguished by their emphasis on high sensitivity, specialized calibration options and a software toolset geared toward industrial and scientific third‑party optics integrations. Compared with generalist cores on this list, Opgal positions itself at a premium with additional calibration services and application-specific tuning that can reduce system-level development time and improve measurement accuracy for demanding use cases. For OEMs integrating bespoke lenses or requiring application‑specific radiometric performance, the Therm-App TH line offers a financially defensible option by lowering integration risk and post‑integration calibration costs.
Smartphone-ready
High accuracy
Smartphone-ready
High accuracy
Review Summary
"Opgal Therm-App TH series OEM modules are appreciated for compactness and decent image quality in mobile/embedded integrations; reviewers note reasonable sensitivity and integration flexibility but say software support and calibration tools lag behind top-tier vendors."
Field tough
Compact OEM module footprint optimized for mobile and embedded applications
Field tough
Compact OEM module footprint optimized for mobile and embedded applications
Recreational Enjoyment
Skill Development & Mastery
Time-Saving Convenience
Opgal’s Therm-App TH Series OEM modules are distinguished by their emphasis on high sensitivity, specialized calibration options and a software toolset geared toward industrial and scientific third‑party optics integrations. Compared with generalist cores on this list, Opgal positions itself at a premium with additional calibration services and application-specific tuning that can reduce system-level development time and improve measurement accuracy for demanding use cases. For OEMs integrating bespoke lenses or requiring application‑specific radiometric performance, the Therm-App TH line offers a financially defensible option by lowering integration risk and post‑integration calibration costs.
Smartphone-ready
High accuracy
Field tough
Compact OEM module footprint optimized for mobile and embedded applications
Supports multiple video/output interfaces and can be adapted to third‑party optics via custom adapters
Smartphone-ready
High accuracy
Field tough
Compact OEM module footprint optimized for mobile and embedded applications
Supports multiple video/output interfaces and can be adapted to third‑party optics via custom adapters
$2,000-4,500 CAD